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translate to [en]: Laserlöten

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  • Through hole

    Through hole

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    [Translate to en:] Litze

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Laser soldering is often used as selective laser soldering. Parts which can not be soldered with reflow or wave are soldered selectively. These can be parts which are particularly sensitive to temperature or, due to their size, need a special temperature program for soldering.

The diagram shows a soldering process that can be defined completely free with a simple programming language and stored in the LASCON® program. The green curve in the diagram shows the setpoint temperature curve. The red curve represents the real temperature by closed loop control in the laser focus (actual temperature). The black curve shows the control output to the diode laser by an analog voltage. The black curve corresponds to the right 0-100% axis scale.

First, the pad is heated to 300 ° C within a temperature ramp. Then LASCON® switches on the solder wire feeder. After approx. 1.4 s, the solder wire feed is switched off. The process can be monitored online and a good-bad decision can be programed.

As an alternative to soldering with solder wire, the laser soldering with solder paste can be performed. The paste must be applied with a dispenser. An optimized temperature program largely prevents spraying.

Advantage of laser soldering with LASCON

  •     Local heat input
  •     Exact temperature control
  •     Online quality control
  •     Delivery of large amounts of heat even on small spots
  •     With scanners, different points can be heated simultaneously or subsequently
  • Smallest solder spot <100 μm
  • Soldering temperatures 140 ° C - 350 ° C
  • Temperature closed loop control with pyrometer. 10,000 control steps per second
  • Up to 256 different scripts programmable with simple software.
  • For every pad geometry an optimized script
  • Video control and analysis with high-resolution camera
  • Soldering with solder wire feeder or paste
  • Wire feeder controlled by the script via internal bus

Main advantage of laser soldering technique is flexibility under precise control.

All process parameters like energy intake, spot size and control parameters are individually matched to every soldering joint, thus achieving supreme connections even under challenging conditions.

Laser soldering is often applied as selective laser soldering, to solder parts that are heat-sensitive, small or hard to access with conventional joining techniques ( reflow or wave soldering ).

With more than 15 years of experience in laser technology we support your soldering application, feel free to contact us for a profound consulting on your process.

The use of a high-brightness diode laser and laser process controller LASCON enables you to control the soldering process by whats important – the right temperature at the right time

non-contact solderingadjustable spot size, minimum 100 micrometer
local, precise energy intakeexact temperature control
on-line quality control100% repeatability, traceability
easy automationvery low maintainance

Selective laser soldering is used in electronics industry to solder smd and through-hole components ( tht ) to printed circuit boards ( pcb ), as well as solar cells in pholtovoltaics industry.

Mergenthaler is supporting his customers worldwide in laser soldering production processes.

Press release ( in german ) for selective laser soldering in Productronic Magazine